| By Dow Packaging |
| Friday, 30 October 2009 |
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The Dow Chemical Company’s (NYSE:DOW) Adhesives and Functional Polymers business unit
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has announced its participation at this year’s Andina-Pack Trade Show being held November 3-6 in Bogotá, Colombia. Dow Adhesives and Functional Polymers will join with its Latin America representatives, Cosalco Group, to present a number of advanced adhesives for packaging applications.
Dow expects intense interest in its offering of high-performance, high-speed solventless laminating adhesives that run at rates up to 600mt/min in BOPP/BOPP structures and at rates of 380mt/min with metalized films. Dow’s legacy solvent-based, solventless and widely used water-based adhesives will also be featured.
These technologies are known for performance and improved packaging economics for advanced packaging applications.
As a leading global supplier of adhesives that combine packaging innovations with unparalleled performance, Dow provides food and consumer goods packaging converters and manufacturers with the means to also reduce greenhouse gases and to reduce their carbon footprint.
The company’s commitment to improved sustainability is a core objective says Brenda Rangel, Latin
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America market manager for Dow Adhesives and Functional Polymers, who explained that the acquisition of the Rohm and Haas adhesives business by Dow earlier this year is now enabling even greater support for those interested in improved sustainability in their end-use packaging.
“Our ability to work closely with, and develop specialized solutions for converters and packaging manufacturers throughout Latin America is now much stronger. We want customers to be keenly aware that improved conversion efficiencies and sustainability can work hand-in-hand with top packaging performance.”
An example is that Dow has recently worked successfully to establish new flexpack applications that produce no greenhouse gas emissions. Prominent industry sources identify sustainability as a global trend that continues to gain momentum in the flexible packaging market.
“Dow’s sustainable product and technology choices enable our flexible packaging customers to reduce their carbon footprint,” says Brad Jacobs, global research manager for Dow Adhesives and Functional Polymers.
“Our close ties to customers and high throughput research and development initiatives make our potential second to none when it comes to adhesion and bonding solutions for packaging. Dow offers resources like timely on-site |
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assistance anywhere in the world, and our company’s pilot coaters help customers efficiently build, test and scale-up new lamination processes with confidence,” adds Jacobs. Dow’s well recognized technology base now coupled with Rohm and Haas’s historical formulating expertise is said to provide added market strength. “Dow anticipates augmenting its sustainable adhesive portfolio on a regular basis,” adds Rangel. “Customers are quickly learning they can depend completely on the power of two market leaders working as one.”
A Dow technical expert will present a paper on their solventless adhesive technology:
“Adhesivos SolventLess mas Eficientes y Sustentables” on November 3rd in la Sala 3, Auditorio 2do piso, 3:00 to 3:45 pm. The company’s Mor-Free™ HSL 970/CR137, Adcote™ HSL 755/756 and Robond™ L-430/CR9X101 adhesives will be featured during Andina-Pack 2009. Customers wishing to discuss these and other Dow adhesives with Dow representatives during Andina-Pack are urged to visit booth location # 122-223, in Pabellón 9.
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